Education & Working Experience

2020.8-now, University of Science and Technology Beijing, Associate Professor.

2018.7-2020.7, Institute of Engineering Thermophysics, Chinese Academy of Sciences, Associate Researcher.

2014.7-2018.6, Institute of Engineering Thermophysics, Chinese Academy of Sciences, Assistant Researcher.

2008.9-2014.6, University of Chinese Academy of Sciences, Doctor.

2012.9-2014.1, University of Notre Dame (USA), Joint-training PhD student.

2004.9-2008.6, University Of Science and Technology Of China, Bachelor.

Research projects

1. JKW Field Fund, Characterization Method and Device Development of High Spatiotemporal Resolution XXXX Interface Thermal Resistance, 2022-2024, 600,000 RMB, Principal Investigator.

2. Youth Innovation Promotion Association, Chinese Academy of Sciences, 2019-2020, 400,000 RMB, Principal Investigator.

3. National Natural Science Foundation of China, Research on Thermophysical Properties of Sensing Layer Materials by TDTR Method under Ultra-High Pressure Conditions, 2017-2019, 200,000 RMB, Principal Investigator.

4. National Natural Science Foundation of China, Research on the Mechanism of Thermal Transport under Ultra-high Pressure Conditions, 2018-2022, 2.29 million RMB, Principal Investigator.

5. Research Equipment Development Project of Chinese Academy of Sciences, Development of Femtosecond and Nano Time/Aerothermal Physical Property Measurement System, 2017-2019, 2.94 million RMB, Principal Investigator.

Postgraduate Training

Graduate students are recruited every year.

Welcome students who are interested in the fields of thermal transport measurement of micro and nano materials, interface heat transport mechanism and regulation, femtosecond laser transient heat reflection technology and motion simulation and heat transfer optimization in the CDQ process to apply, the research group has maintained long-term close cooperation with more than 10 universities and scientific research institutions in China, providing a free and open scientific research atmosphere, welcome you to join!

Academic Achievements

Main journal publications：

Improving interfacial thermal transport in silicon-reinforced epoxy resin composites with self-assembled monolayers[J].Journal of Colloid And Interface Science,2025,681392-403.

Anomalous increase in thermal conductivity of Mg solid solutions by co-doping with two solute elements[J].Acta Materialia,2025,285120708-120708.

A strategy for enhancing interfacial thermal transport in Ga2O3-diamond composite structure by introducing an AlN interlayer[J].Nano Energy,2024,132110389-110389.

Enhancing interfacial heat conduction in diamond-reinforced copper composites with boron carbide interlayers for thermal management[J].Composites Part B,2024,287111871-111871.

High value utilization of waste peanut shell: Prepared novel shape stable composite phase change materials with high thermal conductivity[J].Materials Today Sustainability,2024,26100707-.

Optimization of convection cooling by pressed brick structure and coke conversion rate in coke dry quenching furnace[J].Applied Thermal Engineering,2024,241122433-.

Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers[J].Surfaces and Interfaces,2024,46103985-.

Thermal boundary conductance in heterogeneous integration between β-Ga2O3 and semiconductors[J].Ceramics International,2024,50(11PA):18787-18796.

Regulated Thermal Boundary Conductance between Copper and Diamond through Nanoscale Interfacial Rough Structures.[J].ACS applied materials & interfaces,2023,15(12):

Quantifying Interfacial Bonding Using Thermal Boundary Conductance at Cubic Boron Nitride/Copper Interfaces with a Large Mismatch of Phonon Density of States.[J].ACS applied materials & interfaces,2023,15(28):

Amorphous carbon interlayer modulated interfacial thermal conductance between Cu and diamond[J].Applied Surface Science,2023,638

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W-W2C Interlayer.[J].ACS applied materials & interfaces,2022,

Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface[J].International Journal of Minerals, Metallurgy and Materials,2022,29(11):2020-2031.

Mo-interlayer-mediated thermal conductance at Cu/diamond interface measured by time-domain thermoreflectance[J].Composites Part A,2020,135:

Self-Assembled Monolayers for the Polymer/Semiconductor Interface with Improved Interfacial Thermal Management.[J].ACS applied materials & interfaces,2019,11(45):42708-42714.

Regulated Interfacial Thermal Conductance between Cu and Diamond by a TiC Interlayer for Thermal Management Applications.[J].ACS applied materials & interfaces,2019,11(29):26507-26517.

Enhancing the Thermal Conductance of Polymer and Sapphire Interface via Self-Assembled Monolayer.[J].ACS nano,2016,10(8):7792-8.

Authorized Invention Patents:

1. Fangyuan Sun; Qi Guo; Yanhui Feng; A device and method for measuring the in-plane thermal conductivity of thin films, 2024-8-9, China, 202410257201.3.

2. Fangyuan Sun; Qi Guo; Yanhui Feng; A Contact Thermal Conductivity Measuring Device and Method, 2024-7-26, China, 202410257203.2 (Transferred amount of 505,000 yuan).

3. Fangyuan Sun; Dong Qiu; Dawei Tang; Zhe Chen; Xinwei Wang; Ming Yang; Objective-free measuring device for pumping detection heat reflection system, 2017-3-15, China, CN201611170485.4.

4. Fangyuan Sun; Jingdong Guo; Songxin Gao; Dawei Tang; Zhe Chen; Xinwei Wang; A Microscopic Visualization Pumping Detection Heat Reflection System, 2017-2-22, China, CN201611175169.6.

5. Zhuming Liu; Dazheng Wang; Fangyuan Sun; Libing Zheng; Bohua Yin; Li Han; A near-field heat reflection measurement device, 2019-3-8, China, CN201811340304.7.

6. Libing Zheng; Zhuming Liu; Fangyuan Sun; Dazheng Wang; Li Han; High-throughput measurement system and method for thermoelectric transport parameters, 2019-1-8, China, 201810989600.3.

7. Zhuming Liu; Libing Zheng; Fangyuan Sun; Bohua Yin; Li Han; Thermal Reflectance Measurement System, 2018-12-25, China, 201810714764.5.

8. Bin Liu; Hang Zhang; Xiulan Huai; Jun Cai; Zhe Chen; Fangyuan Sun; Ming Yang; Thermal Conductive Silicone Grease Composition with High Thermal Conductivity and Low Viscosity and Preparation Method Thereof, 2017-9-14, China, 201710825199.5.